A two-part epoxy adhesive cures at room temperature once a resin side (Part A) and an amine-type hardener side (Part B) are mixed at a fixed ratio, and heat speeds the reaction and raises the glass transition temperature (Tg). Among industrial adhesive chemicals, two-part (2K) epoxies are the reactive thermosets that bond metals, composites, ceramics and wood without an oven.
Three settings decide performance: mix ratio, mixed mass and cure temperature. The ratio follows stoichiometry, so diethylenetriamine (DETA) needs 10.9 parts per hundred parts of resin (phr) at an epoxide equivalent weight (EEW) of 190 g/eq. The mixed mass sets the pot life, and the cure temperature sets which Tg the network reaches.
A polyamide-cured mix of 200 g stays workable for 2 h at 25 °C (77 °F), while 450 g of an aerospace paste gives 90 min; that paste is rated for service at 177 °C (350 °F) although its dry Tg is 78 °C. Liquid bisphenol A epoxy resin carries CLP Annex VI entry 603-074-00-8, isophorone diamine (IPDA) carries 612-067-00-9 with Skin Sens. 1A, epoxy mixtures carry EUH205, and 21 CFR 175.105(c)(5) names the resin, IPDA and dimer-acid polyamides for food-packaging adhesives.
Sources and checks: identities and hazard classifications are read at ECHA and the issuing regulator, standards at the body that publishes them, and grade values at the data sheet named next to them; methodology and fact-checking explains each step.
What Is a Two-Part Epoxy Adhesive?#
A two-part epoxy adhesive is a reactive adhesive supplied as a separate epoxy resin component and hardener component that start a step-growth addition reaction only after metered mixing. Neither side cures on its own in the container. Once the two sides meet, the growing network turns the liquid mix into a crosslinked thermoset that does not melt again.
One-part epoxy adhesives carry a latent hardener in a single paste and need an oven to cure. Both routes and their sub-chemistries are compared under epoxy adhesives.
How Part A and Part B React at Room Temperature#
Part A and Part B react at room temperature because each primary and secondary amine hydrogen of the hardener adds to one epoxide ring of the resin, and each opened ring leaves a hydroxyl group behind. Those hydroxyl groups speed the next additions, so the reaction is autocatalytic.
Co-reactive hardeners, such as amines, polyamides and polythiols, join the network and are dosed near stoichiometry. Catalytic agents, such as tertiary amines and imidazoles, trigger homopolymerization of the resin at a few phr.
Accelerators add or quickly create hydroxyl groups, raise the exotherm temperature, or both, in B. Burton's paper "Acceleration of Epoxy Resin Systems" (2013). Heat speeds the reaction from outside and lets the network reach a higher Tg.
What Goes Into Part A and Part B?#
Part A carries the epoxy resin with reactive diluents, tougheners and fillers, and Part B carries the amine hardener with accelerators and fillers, dosed against Part A by equivalent weight. The table below compares the eleven components of both sides by function and by published loading with its basis; the resin counts as 100 parts throughout.
| Side | Component | Function | Loading (basis, source) |
|---|---|---|---|
| A | thermoset adhesive resins: bisphenol A epoxy resin | base resin, network former | 100 parts, the reference for every phr value |
| A | bisphenol F epoxy resin | low-viscosity base or co-resin | not stated in the source |
| A | epoxy reactive diluents | viscosity reducer | HELOXY Modifier 8 (C12-14 alkyl glycidyl ether) at most about 20 % of the resin portion (Westlake TDS, read 2026-11-02) |
| A | epoxy tougheners | CTBN adduct or core-shell rubber supplied in liquid epoxy resin | not stated for two-part systems in the source |
| A and B | fillers for adhesives | rheology, cost, bond line | 230 parts in 460 parts of filled Part A (resin producer worked example, formula table below) |
| B | aliphatic and cycloaliphatic amines | co-reactive hardener | stoichiometric, AHEW × 100 / EEW |
| B | polyamide hardeners | co-reactive hardener with a forgiving ratio | ratio window in the formula table below |
| B | phenalkamine hardeners | cold and damp-surface hardener | stoichiometric to the producer AHEW (no grade value written) |
| B | polyetheramine hardeners | long working time, flexible bond | stoichiometric to the producer AHEW |
| B | polythiol hardeners | fast ambient cure with a tertiary amine | not stated in the source |
| B | epoxy accelerators | catalyst, polythiol activator | DMP-30 3 to 5 phr in accelerator screening (Burton, 2013) |
Part A: Base Resin, Diluents, Tougheners and Fillers#
Part A is built on liquid bisphenol A epoxy resin, with bisphenol F epoxy resin as a lower-viscosity base or co-resin. In the Dow Epoxy Resins Product Overview Guide (Form 296-01864-0213), the bisphenol A grade D.E.R. 331 has an EEW of 182 to 192 g/eq and 11,000 to 14,000 mPa·s (cP) at 25 °C, against 167 to 174 g/eq and 3,400 to 4,200 mPa·s for the bisphenol F grade D.E.R. 354. The methylene bridge of bisphenol F lowers viscosity at a similar EEW, so less diluent is needed. Low-viscosity liquid epoxy resins crystallize at room temperature and turn liquid again at 50 to 55 °C (122 to 131 °F); the hydrolyzed glycol end groups of standard resin hinder crystallization (Burton, 2013).
Reactive diluents are glycidyl ethers that co-react, so they cut viscosity without solvent. Monofunctional diluents, such as C12-14 alkyl glycidyl ether, lower crosslink density, Tg and chemical resistance in proportion to dose, while difunctional 1,4-butanediol diglycidyl ether (BDDGE) holds network density. Any diluent dose shifts the EEW on which the hardener is calculated. Tougheners arrive as carboxyl-terminated butadiene-acrylonitrile (CTBN) adducts or core-shell rubber masterbatches in liquid epoxy resin, and their rubber phase raises fracture energy.
Part B: Amine, Polyamide, Phenalkamine and Thiol Hardeners#
Part B carries one of six hardener types: aliphatic amines, cycloaliphatic amines, polyamides, phenalkamines, polyetheramines or polythiols, each suited to a different cure condition.
Aliphatic amines, such as DETA and triethylenetetramine (TETA), cure fast at room temperature. Cycloaliphatic amines, such as IPDA and DCH (CAS 694-83-7), give clear bond lines and a higher Tg: with EPON 828 resin, IPDA reaches 158 °C and DCH-99 176 °C by DSC second run (typical product values, INVISTA, page read 2026-11-02). Polyamide hardeners flexibilize the bond through their fatty backbone, tolerate a non-critical mix ratio and absorb moisture and carbon dioxide in open containers.
Phenalkamines are offered as low-temperature and damp-surface epoxy hardeners. Polyetheramines give long pot life, low exotherm and flexibility through hindered amines on a polypropylene oxide chain, but need an accelerator or heat. Polythiols cure fast at ambient and low temperature once a tertiary amine converts the thiol to thiolate. Excess 2,4,6-tris(dimethylaminomethyl)phenol (DMP-30), screened at 3 to 5 phr, gives odor, yellowing, brittleness and Tg loss. Selection logic across every hardener family is set out under curing agents and hardeners.
Mix Ratio of a Two-Part Epoxy Adhesive#
The mix ratio of a two-part epoxy adhesive follows stoichiometry: one amine hydrogen per epoxide group, so the hardener dose equals AHEW × 100 / EEW parts per hundred parts of resin. The amine hydrogen equivalent weight (AHEW) is the mass of hardener carrying one reactive N-H, and the EEW is the mass of resin carrying one epoxide group.
Hardener Dose of a Two-Part Epoxy in Parts per Hundred Resin#
The hardener dose in phr is the AHEW of the amine times 100, divided by the EEW of the resin. The AHEW is the molar mass of the amine divided by its number of active N-H hydrogens: DETA has a molar mass of 103.2 g/mol and five active hydrogens, so its AHEW is 20.6 g/eq. With a liquid epoxy resin of EEW 189 or 190 g/eq, that gives 10.9 phr of DETA (calculated). The amine value of a hardener is not its AHEW, because it also counts tertiary nitrogen, which carries no active hydrogen.
Reactive accelerators with N-H are counted, such as APDEA with an AHEW of 81.1 g/eq (Burton, 2013). Diluents and second resins change the EEW, so the dose is recalculated on the blend EEW: total weight divided by the sum of each epoxy component's weight over its EEW, filler counted in the total only. A product's stated mix ratio overrides any calculation; the hardener mix ratio calculator runs the blend arithmetic.
The table below compares the calculated stoichiometric doses of five amines with a resin of EEW 190 g/eq.
| Amine | AHEW (g/eq, molar mass / active H, calculated) | Dose at EEW 190 (phr, calculated) |
|---|---|---|
| DETA (diethylenetriamine) | 20.6 | 10.9 |
| TETA (triethylenetetramine) | 24.4 | 12.8 |
| MXDA (m-xylylenediamine) | 34.0 | 17.9 |
| IPDA (isophorone diamine) | 42.6 (also the published value for Baxxodur EC 201, BASF, page read 2026-11-02) | 22.4 |
| PACM (4,4'-diaminodicyclohexylmethane) | 52.6 | 27.7 |
Calculated stoichiometric doses; a formulated product's stated ratio overrides them.
Two Published Two-Part Starting Formulas#
Two published starting formulas show the stoichiometric rule as a mix: a filled resin-producer example cured with DETA, and a polyamide-cured system from a hardener producer. The table below compares both formulas in parts and the first one also in mixed wt %.
| Component | Formula 1: worked example (parts), Dow Epoxy Resins Product Overview Guide, Form 296-01864-0213, read 2026-11-02 | Formula 1: mixed wt % (calculated from parts) | Formula 2 (parts), BASF Versamid 140 TDS, May 2014 |
|---|---|---|---|
| Liquid bisphenol A epoxy resin D.E.R. 331 (EEW 189) | 100 | 21 | |
| Bisphenol A epoxy resin D.E.R. 337 (EEW 240) | 100 | 21 | |
| 1,4-Butanediol diglycidyl ether (EEW 130) | 30 | 6 | |
| Filler | 230 | 48 | |
| DETA (AHEW 20.6) | 24.2 | 5 | |
| Liquid epoxy resin (EEW 190) | 100 | ||
| Versamid 140 polyamide hardener | 50 to 70 (33 to 41 wt % of the mix, calculated) | ||
| Total | 484.2 | 100 (101 after rounding) | 150 to 170 |
Published examples from a resin producer guide and a hardener producer data sheet, not recommendations.
Formula 1 has a blend EEW of 391 g/eq because filler adds weight but no epoxide, so DETA falls to 5.27 parts per hundred parts of filled Part A, about half its neat-resin dose. Every ratio therefore needs its basis stated.
In Formula 2 the polyamide makes up 33 to 41 wt % of the mix (calculated: 50 of 150 and 70 of 170 parts). The 20-part window between 50 and 70 phr is a forgiving ratio in numbers, and application starts at 15 °C (59 °F).
Weight Ratio, Volume Ratio and Off-Ratio Mixing#
Producers state the mix ratio either by weight or by volume, and the densities of the two parts convert one into the other. The aerospace paste LOCTITE EA 9394 AERO mixes 100:17 by weight (Henkel TDS Rev. 7/2015), so its hardener is about 15 wt % of the mix (calculated, 17 of 117 parts), while the panel-bonding adhesive TEROSON EP 5055 mixes 1:1 by volume (Henkel TDS, November 2024).
Off-ratio mixing gives a soft bond when the hardener is short and a brittle bond when it is in excess. Polyamide systems tolerate deviation better, because their ratio is non-critical.
Pot Life of Two-Part Epoxy Adhesives and the Mixed Mass#
The pot life of a two-part epoxy adhesive is the working time of a stated mixed mass at a stated temperature, and it shortens as the mass grows because the reaction heat cannot escape. The table below compares pot life and cure schedule for three systems with their mass, temperature and basis.
| System (grade, producer, data sheet date) | Mixed mass, temperature | Pot life | Cure schedule | Basis |
|---|---|---|---|---|
| Versamid 140 polyamide with EEW 190 liquid epoxy, 100:50 to 70 (BASF TDS, May 2014) | 200 g, 25 °C (77 °F) | 2 h | not stated; application not below 15 °C (59 °F) | typical product value |
| LOCTITE EA 9394 AERO paste, 100:17 by weight (Henkel TDS Rev. 7/2015) | 450 g, 25 °C (77 °F) | 90 min | handling strength 24 h; 3 to 5 days at 25 °C (77 °F) or 1 h at 66 °C (150.8 °F) | typical product value |
| Fast-curing epoxy, isothermal DSC study (open-access study PMC13120039) | DSC sample | not applicable | degree of cure 0.805 at 60 °C, 0.918 at 80 °C, 0.963 at 100 °C, 0.976 at 120 °C | laboratory values |
Pot-life values compare only at equal mass and temperature. The current method for the pot life of structural adhesives is ISO 10364:2024, the fourth edition, and EN 14022:2010 was withdrawn on 2018-03-16. The aerospace paste value is measured in a water bath by ASTM D2471-99, which was withdrawn in 2008 with no replacement and is still cited on data sheets. Methods and gel time for the pot life of industrial adhesives sit with the testing pages.
Large masses overheat because the reaction exotherm builds up faster than a deep container releases it. Henkel's data sheet limits a single mix of EA 9394 AERO to 450 g for this reason.
Room-Temperature and Heat-Accelerated Cure of Two-Part Epoxy#
A two-part epoxy adhesive reaches handling strength at room temperature within a day and full properties within days, and a moderate heat cure shortens this to about an hour. In the aerospace paste above, 1 h at 66 °C replaces several days at 25 °C, and its property values are measured after a 5-day room-temperature cure.
The degree of cure rises with temperature. In an isothermal DSC study of a fast-curing epoxy, the degree of cure rose from 0.805 at 60 °C to 0.976 at 120 °C, and the Tg after cure rose from 66.3 °C to 116.9 °C (laboratory values). Chemical reaction is one of four cure routes, and how adhesives cure by chemical reaction compares it with evaporation, cooling and radiation.
A room-temperature cure cannot give a Tg far above the cure temperature without a post-cure (Carbas et al., The Journal of Adhesion 90, 2014, 104 to 119). Cycloaliphatic amines need a post-cure to reach their full Tg, so a bond that must hold above room temperature needs heat in its schedule.
Properties of Cured Two-Part Epoxy: Strength, Peel and Service Temperature#
Cured two-part epoxy adhesives are rigid, high-shear thermosets: a room-temperature-cure aerospace paste reaches 28.9 MPa (4,200 psi) lap shear on anodized aluminum at 25 °C (typical product value, LOCTITE EA 9394 AERO, Henkel TDS). The table below lists that paste's strength from -55 °C to 177 °C with the method and edition behind each value.
| Property | Value (LOCTITE EA 9394 AERO, Henkel TDS Rev. 7/2015; phosphoric acid anodized 2024-T3 aluminum, cured 5 days at 25 °C) | Method and edition | Method page |
|---|---|---|---|
| Lap shear | 22.7 MPa at -55 °C (-67 °F); 28.9 MPa (4,200 psi) at 25 °C (77 °F); 15.8 MPa at 121 °C (249.8 °F); 11.0 MPa at 149 °C (300.2 °F); 8.3 MPa (1,200 psi) at 177 °C (350 °F) | ASTM D1002-10(2019), active | lap shear strength testing |
| Service temperature | 177 °C (350 °F), defined as the temperature still retaining 6.9 MPa (1,000 psi) lap shear | ASTM D1002 (producer definition) | |
| Tg | 78 °C dry, 68 °C wet | method not stated on the data sheet | |
| T-peel | 5 lb/in (21.9 N/25 mm, calculated) at 25 °C | ASTM D1876-08(2023), active | peel adhesion testing |
| Floating roller (bell) peel | 89 N/25 mm (20 lb/in) | ASTM D3167-10(2025), active | |
| Pot life | see the pot-life table | ISO 10364:2024 current; ASTM D2471-99 withdrawn 2008 |
The paste keeps about 29 % of its 25 °C lap shear at 177 °C (calculated, 8.3 of 28.9 MPa).
The service rating sits about 100 °C above the dry Tg (calculated), because it is a strength-retention limit, not a softening point; the two are separated under service temperature and Tg.
Peel is the weak load case. Cured epoxy is rigid unless a rubber phase is added, so peel loads, not shear, limit an unmodified two-part bond.
Which Substrates Do Two-Part Epoxy Adhesives Bond?#
Two-part epoxy adhesives bond 4 substrate groups: metals, fiber-reinforced composites, ceramics and wood. The four substrate groups are listed below.
- Metals, such as aluminum and steel
- Fiber-reinforced composites
- Ceramics
- Wood
Aluminum bonds well once the surface is etched or phosphoric acid anodized, the preparation set out in ASTM D3933-98(2025) and used for the properties table.
Strength on every substrate depends on surface preparation, and epoxy bonds low-energy plastics only after treatment. Abrasion, primers, plasma and flame are compared under surface preparation for bonding.
Regulation and Labeling of Two-Part Epoxy Adhesives#
Two-part epoxy adhesives are regulated through the hazard classes of their raw materials, the EUH205 supplemental label for mixtures with epoxy constituents of average molecular weight up to 700, and food-contact listings where packaging is bonded. Each part carries its own label. EUH205 comes from CLP Annex II section 2.5 (Regulation (EC) No 1272/2008, consolidated text of 2026-07-01); isocyanate mixtures carry EUH204 instead.
Hazard Lines of Two-Part Epoxy Raw Materials#
Liquid bisphenol A epoxy resin, the base of Part A, carries CLP Annex VI entry 603-074-00-8: Skin Irrit. 2 H315, Eye Irrit. 2 H319, Skin Sens. 1 H317 and Aquatic Chronic 2 H411. The entry covers the resin with a number average molecular weight up to 700 (CAS 25068-38-6, EC 500-033-5), and the bisphenol A diglycidyl ether (BADGE) monomer has its own entry, 603-073-00-2, without H411. Glycidyl ether diluents carry entries of their own.
On the Part B side, IPDA carries Annex VI entry 612-067-00-9 with Skin Sens. 1A since ATP17 (Regulation (EU) 2021/849, applicable 2022-12-17). Benzyl alcohol, used in amine hardener adducts, carries 603-057-00-5 with Skin Sens. 1B since ATP21 (Regulation (EU) 2024/197, applicable 2025-09-01). Label wording and the supplemental statements for adhesives are covered under hazard labeling for adhesives.
The table below compares the hazard lines of eight Part A and Part B raw materials.
| Substance | Side | CAS (EC) | Hazard line |
|---|---|---|---|
| Liquid epoxy resin (bisphenol A-epichlorohydrin, number average MW ≤ 700) | A | 25068-38-6 (EC 500-033-5) | Annex VI 603-074-00-8: Skin Irrit. 2 H315, Eye Irrit. 2 H319, Skin Sens. 1 H317, Aquatic Chronic 2 H411 |
| BADGE monomer | A | 1675-54-3 (EC 216-823-5) | Annex VI 603-073-00-2: H315, H319, H317 |
| Bisphenol F epoxy resin | A | 9003-36-5 (EC 500-006-8) | No Annex VI entry |
| C12-14 alkyl glycidyl ether | A | 68609-97-2 (EC 271-846-8) | Annex VI 603-103-00-4: H315, H317 |
| 1,4-Butanediol diglycidyl ether | A | 2425-79-8 (EC 219-371-7) | Annex VI 603-072-00-7: H332, H312, H315, H319, H317 |
| IPDA (isophorone diamine) | B | 2855-13-2 (EC 220-666-8) | Annex VI 612-067-00-9 (ATP17, Reg. (EU) 2021/849, applicable 2022-12-17): H302, H314, H318, Skin Sens. 1A H317 |
| Benzyl alcohol | B | 100-51-6 (EC 202-859-9) | Annex VI 603-057-00-5 (ATP21, Reg. (EU) 2024/197, applicable 2025-09-01): Acute Tox. 4 H302, Eye Irrit. 2 H319, Skin Sens. 1B H317 |
| Polyamide and phenalkamine hardeners | B | polymer or UVCB | see supplier SDS |
Polyamide and phenalkamine hardeners have no single hazard line: free amine content drives their classification, so the supplier safety data sheet applies.
Food-Contact Status of Two-Part Epoxy Components#
In the US, 21 CFR 175.105(c)(5) names epichlorohydrin-4,4'-isopropylidenediphenol resin, cyanoguanidine, IPDA and polyamides of dimerized vegetable oil acids with listed amines such as DETA and TETA. The rule allows these components in food-packaging adhesives only behind a functional barrier or, for fatty and aqueous food, as no more than the trace amount at seams and at the edge exposure between packaging laminates (eCFR, up to date as of 2026-10-30). The container label must read "food-packaging adhesive".
In the EU, Regulation (EU) 2024/3190 prohibits bisphenol A in the manufacture of food-contact adhesives, and Regulation (EC) No 1895/2005 sets the BADGE limits; both are covered under food-contact adhesives.
A listing covers components, not products: a mixed adhesive meets 175.105 only when every component is listed and its conditions of use are kept.
How to Choose a Two-Part Epoxy Adhesive#
Choose a two-part epoxy adhesive by cure conditions first (temperature, humidity, mixed mass), then by the load case and the service temperature the bond must hold. The table below matches eight requirements to a hardener route or a sibling chemistry, with the evidence behind each.
| Requirement | Route | Evidence |
|---|---|---|
| Forgiving ratio, general bonding | polyamide-cured two-part epoxy | 50 to 70 phr ratio window (BASF Versamid 140 TDS, May 2014) |
| Fast ambient cure | aliphatic amines or adducts; polythiol with a tertiary amine | hardener selection logic (Burton, 2013; INVISTA, page read 2026-11-02) |
| Clear bond line, higher Tg | IPDA or DCH, with post-cure | cycloaliphatic Tg values in the Part B section |
| Cold or damp work | phenalkamine | hardener selection logic |
| Long working time, flexibility | polyetheramine plus accelerator | hardener selection logic |
| Oven available, long shelf life | one-part heat-cure epoxy adhesives | latent hardener route |
| Peel and impact loads | toughened epoxy adhesives | rubber phase raises fracture energy |
| Service near or above 177 °C | high-temperature epoxy adhesives | strength-retention definition of service temperature |
A sibling chemistry fits better when the joint carries peel or impact, needs a long shelf life, or must hold near 177 °C. For load-bearing joints, two-part epoxy also competes with acrylic and polyurethane chemistries that bond in place of fasteners, compared under structural epoxy adhesives.
Failure Modes and Limits of Two-Part Epoxy Adhesives#
Two-part epoxy adhesives fail in five recurring ways, each traceable to ratio, mass, surface chemistry, storage or accelerator dose. The five failure modes are listed below.
- Off-ratio cure: a soft bond with too little hardener, a brittle bond with too much.
- Exotherm in large masses: overheating that shortens working time.
- Amine blush: surface carbamate salts from primary amines, carbon dioxide and water, worse in cold and humid conditions, which hurt gloss and secondary-bond adhesion.
- Part A crystallization: low-viscosity resins that solidify until warmed.
- Yellowing and brittleness: excess tertiary amine accelerator.
Amine blush depends on the hardener adduct. At 23 °C and 50 % relative humidity, carbamate formed after 2 h with an MXDA adduct and after 16 h with an IPDA adduct, while an MCDA adduct showed only slight turbidity at 16 h (BASF data, PCI magazine, 2019). Benzyl alcohol in such adducts lowers the Tg by 40 to 70 °C.
Each request is passed straight to independent companies of that trade, and no company pays AdhesiveAdditives.com to be named or to receive requests; the editorial policy explains how.
Two-Part Epoxy Adhesives in Industry and Occupational Health#
Two-part epoxy adhesives serve industries that need a structural bond without an oven, and their users handle sensitizing resins, diluents and amines. Epoxy against two-part polyurethane is compared under epoxy vs polyurethane adhesives. Floor, anchor and grout epoxies are construction products and are not covered here.
Where Are Two-Part Epoxy Adhesives Used?#
Two-part epoxy adhesives are used in three industrial fields: aerospace, vehicle repair and electronics potting. The three uses are listed below.
- aerospace paste adhesives: room-temperature-cure structural paste, potting and liquid shim (LOCTITE EA 9394 AERO, Henkel TDS Rev. 7/2015)
- automotive adhesives: repair panel bonding (TEROSON EP 5055, Henkel TDS, November 2024)
- potting and encapsulation compounds: a rigid encapsulant that protects components against moisture, vibration and thermal shock
Skin Sensitization to Two-Part Epoxy Raw Materials#
Two-part epoxy raw materials sensitize skin: patch-test positivity to bisphenol A diglycidyl ether (DGEBA) in German IVDK occupational dermatitis patients fell from 4.2 % (2008 to 2010) to 2.9 % (2020 to 2022). In the same analysis (Reissig et al., Contact Dermatitis, 2026), DGEBA-positive patients were co-sensitized to the diluents HDDGE (43.6 %), BDDGE (35.7 %) and phenyl glycidyl ether (30.8 %) and to the hardener MXDA (22.7 %). Testing DGEBA alone missed 1.9 % of the patients sensitized to diluents or hardeners.
What Should a Two-Part Epoxy Data Sheet State?#
A two-part epoxy data sheet should state six fields that let a buyer compare grades on the same basis. The six fields are listed below.
- Mix ratio by weight and by volume, with densities
- Pot life with mixed mass and temperature
- Cure schedule with temperature
- Lap shear with substrate, preparation and method edition
- Service temperature with its definition, and Tg with its method
- Hazard statements of each part